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NUP2114 Series, SNUP2114UCMR6T1G
PACKAGE DIMENSIONS
TSOP ? 6
CASE 318G ? 02
ISSUE U
C
E1
NOTE 5
0.05
A1
e
6
1
5
2
D
4
3
E
b
A
c
H
L
M
DETAIL Z
DETAIL Z
L2
GAUGE
PLANE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
MILLIMETERS
DIM MIN NOM MAX
A 0.90 1.00 1.10
A1 0.01 0.06 0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90 3.00 3.10
E 2.50 2.75 3.00
E1 1.30 1.50 1.70
e 0.85 0.95 1.05
L 0.20 0.40 0.60
L2 0.25 BSC
M 0 ? ? 1 0 ?
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
3.20
6X
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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